Semiconductor devices. Mechanical and climatic test methods - Die shear strength1 Scope This part of IEC 60749 determines (see note) the integrity of materials and procedures used to attach semiconductor die to package headers or other substrates (for the purpose of this test method, the term semiconductor die should be taken to include passive elements). This test method is generally only applicable to cavity packages or as a process monitor. It is not applicable for die areas greater than 10 mm2. It is also not applicable to

British Standards such as BS EN 1869

High alloyed austenitic stainless steel

It also covers the submerged areas of appurtenances

are devices whereby the radio energy is used for a purpose other than communications

What is BS EN 2647 – Hexagonal nuts about

switchgear and similar electrical equipment in which oil is required as an insulant or for heat transfer

business transactions

BS 5502-33 on the control of odour pollution in agricultural buildings and structures applies to:

Attention is drawn to the fact that

4 Specifying springs for general purposes

Using BS 7127-1 you will be in a position to facilitate clear communication across the medical industry that

BS 5424-2 is added to IEC Publication 158-1: Low voltage controlgear