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Semiconductor devices. Micro-electromechanical devices - Test method of bonding strength between PDMS and glass

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Semiconductor devices. Micro-electromechanical devices - Test method of bonding strength between PDMS and glass1 Scope This part of IEC 62047 describes test method for bonding strength between poly dimethyl siloxane (PDMS) and glass. Silicone based rubber, PDMS, is used for building of chip based microfluidic devices fabricated using lithography and replica moulding processes. The problem of bonding strength is mainly for high pressure applications as in the case of certain peristaltic pump designs where an off chip compressed air supply is used to drive the

The code includes the 10 digits as well as the 52 small and capital letters of the basic Latin alphabet and may include accented letters

Alloyed steels may also be chosen for above average tensile strengths

This document does not include specific tests of other standards referenced within ISO 15118‐2

BS 3221-1 describes the style

which causes a fault current

BS IEC 61747‑40‑1 provides mechanical performance testing guidelines for cover glass used in electronic flat panel displays in mobile devices

BS 1428 discusses the specification of capillary pipettes of microchemical apparatus

if used in other circumstances

methods of Testing

mechanical transfer or toner technology (e

Why should you use BS EN 2070-4 - Aluminium tubes for structures specification

electric values

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