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Semiconductor devices. Micro-electromechanical devices - Test method of bonding strength between PDMS and glass
Description
Semiconductor devices. Micro-electromechanical devices - Test method of bonding strength between PDMS and glass1 Scope This part of IEC 62047 describes test method for bonding strength between poly dimethyl siloxane (PDMS) and glass. Silicone based rubber, PDMS, is used for building of chip based microfluidic devices fabricated using lithography and replica moulding processes. The problem of bonding strength is mainly for high pressure applications as in the case of certain peristaltic pump designs where an off chip compressed air supply is used to drive the
The code includes the 10 digits as well as the 52 small and capital letters of the basic Latin alphabet and may include accented letters
Alloyed steels may also be chosen for above average tensile strengths
This document does not include specific tests of other standards referenced within ISO 15118‐2
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which causes a fault current
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if used in other circumstances
methods of Testing
mechanical transfer or toner technology (e
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electric values
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